Bonding Processing and 3D Integration of High-Performance Silicon PIN Detector for ?E-E telescope
نویسندگان
چکیده
Currently, the integration method of silicon PIN radiation detectors faces challenges such as complex processes, poor reliability and thick dead layers. Novel methods based on metal bonding technology for realizing thin are needed with requirement reducing signal crosstalk, package volume weight. Combined current research technology, this paper presents an extensive review especially Al to provide a certain reference future processing high-performance detector devices.
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ژورنال
عنوان ژورنال: Processes
سال: 2023
ISSN: ['2227-9717']
DOI: https://doi.org/10.3390/pr11020627